Computer cooling components Hewlett Packard Enterprise

The HP Modular Cooling System is the innovative self-cooled rack for high density deployments in the datacenter. HP's new cooling technology makes possible the deployment of up to 30KW in a single rack, bringing hardware densities and power consumption levels that have been difficult, if not impossible, to cool previously. HP MCS is designed to complement the existing conventional datacenter cooling by adding computing power without adding to the current heat load in the datacenter. In addition, by packing three times the KW capacity of a standard rack, the MCS will extend considerably the life of your datacenter.

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